REIMAGINE YOUR SUPPLY CHAIN
THE SUPERIOR THERMAL PASTE
Our propriety thermal paste allows for any metal material to be cured at room temperature and omit the need to soldier or screw to keep the products in place.
The paste is also thermal conductive
This allows for engineers to repurpose the time saving used for transporting the IC or chipset to another vendor for thermal paste and securing of products.
Total savings from will also include the Manpower savings, streamlining supply chain and lastly the cost for screws/ products that were used traditionally to secure the IC.
Tackling issue of carbon emission
-Replacing current process-flow by using IMST Metal Adhesive.
-Manpower reduction by omitting screws
-Omit the need for thermal paste as our paste allows for thermal conductivity
-Remove the need for soldering/baking of any thermal/glue paste.
Environmental protection
No electroplating and soldering process is required.
Simple process
Adhesion at room temperature, no baking and no power consumption.
Advantages
- High tensile strength Tensile test > 200N/cm2
- Metal with different thickness such as stamping parts and die castings can be used.
- Reduce carbon emissions
- Price has cost advantage
